Trump's tech stamp; Chiplet Summit announcements; AI diffusion export concerns; Cadence's security acquisition; chiplets; UMC ...

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

This enables the EUV lithography era of today, which is likely to continue for the foreseeable future. Initially, EUV became ...

Brewer Science's new co-CEOs talk about shifts in materials for IC manufacturing, flexible substrates, and the uncertainties ...

GaN is especially well-established in low-power applications like chargers for personal electronics, while silicon and SiC ...

The MEMS & Imaging Sensors Summit demonstrated how collaboration, sustainability, and innovation are driving the sensor ...

Accelerate tool development and reduce the consumption of physical resources like silicon wafers, chemicals, and gases.

High density and complex connectivity introduce new challenges for packaging design and assembly manufacturing validation.

Reverse Engineering Approach for Evaluating Hardware IP Protection” was published by researchers at University of Florida and Indiana University. Abstract “Existing countermeasures for hardware IP ...

Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form ...

A New Class of Memory for the AI Era” was published by researchers at Microsoft. Abstract “AI clusters today are one of the ...

Delamination occurs when there is a mismatch in coefficients of thermal expansion (CTE) between the encapsulate materials, such as the mold compound used to encapsulate the semiconductor chip and the ...